GlobalFoundries has secured a $2 billion agreement to manufacture a critical AI-chip packaging component for TSMC at its New York facility.
The component, a silicon interposer, links processors and high-bandwidth memory in advanced chip packages.
Packaging has become an AI bottleneck
As demand for AI accelerators rises, advanced packaging capacity has become nearly as important as wafer production itself.
The agreement gives TSMC additional U.S.-based capacity while expanding GlobalFoundries’ role in the high-end semiconductor supply chain.
The deal also illustrates how chipmakers that traditionally compete in foundry services are increasingly cooperating to meet extraordinary AI demand.
Sources
- GlobalFoundries corporate announcement
- Reuters, Oct. 8, 2026
